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ʻO Alumina-Based Porous Ceramic Vacuum Chuck no ka lawelawe ʻana i ka wafer lahilahi

ʻO Alumina-Based Porous Ceramic Vacuum Chuck no ka lawelawe ʻana i ka wafer lahilahi

Wehewehe Pōkole:

Hana ʻia ka chuck porous alumina a St.Cera mai ka 99.6% Al₂O₃ kiʻekiʻe-maʻemaʻe me ka porosity hāmama i kāohi ʻia o 30-45% a me ka nui o ka pore like mai 10 a 50 μm. ʻAʻole e like me nā chucks grooved, hāʻawi ka ʻili porous i ka vacuum i hoʻolaha ʻia ma ka ʻaoʻao hope o ka wafer holoʻokoʻa, e hoʻopau ana i ka māka lihi a hiki ke paʻa mālie i nā wafers ultra-thin (≤100 μm) a i ʻole warped. Hāʻawi ka mea i ka ikaika flexural ≥250 MPa a me ke kūpaʻa thermal a hiki i 400°C i ka lewa.


Nā kikoʻī huahana

Nā Lepili Huahana

Hana ʻia ka chuck porous alumina a St.Cera mai ka 99.6% Al₂O₃ kiʻekiʻe-maʻemaʻe me ka porosity hāmama i kāohi ʻia o 30-45% a me ka nui o ka pore like mai 10 a 50 μm. ʻAʻole e like me nā chucks grooved, hāʻawi ka ʻili porous i ka vacuum i hoʻolaha ʻia ma ka ʻaoʻao hope o ka wafer holoʻokoʻa, e hoʻopau ana i ka māka lihi a hiki ke paʻa mālie i nā wafers ultra-thin (≤100 μm) a i ʻole warped. Hāʻawi ka mea i ka ikaika flexural ≥250 MPa a me ke kūpaʻa thermal a hiki i 400°C i ka lewa.

 

Nā kikoʻī(ma muli o 99.6% AlO):

Waiwai Waiwai
Mea Hana 99.6% Alumina (Keʻokeʻo)
Ka porosity 30–45% (hiki ke hoʻololi ʻia)
Ka nui o nā poho awelika 10–50 μm
Ikaika Flexural ≥250 MPa
Ka nui o ka paʻa 3.88 g/cm³
Palahalaha (ma luna o 200mm) ≤5 μm
Mahana Hana Loa 400°C (ea)
Hoʻopau ʻili Hoʻopaʻa ʻia (Ra ≤0.8 μm)

 

Nā noi:

  • · Wili ʻaoʻao hope o ka wafer lahilahi (≤50 μm)
  • · Ke kau ʻana o ka wafer warped no ka dicing
  • · Ka ʻohi ʻana i ka make hoʻokahi
  • · Ka lawelawe ʻana i ka substrate aniani

 

Hana ʻana:

Pauka i kāwili ʻia me nā mea hana pore → kaomi isostatic → sintering ma 1600°C → lapping a hiki i ka mānoanoa hope loa. Hoʻāʻo ʻia kēlā me kēia chuck no ke ʻano like o ka vacuum (ka ʻokoʻa o ke kaomi <5%) a nānā ʻia no ka hoʻolaha ʻana o ka nui o ka pore (SEM).

 

Nā pōmaikaʻi ma mua o nā chucks maʻamau:

  • · ʻAʻohe māka wafer backside a i ʻole ka hoʻololi make
  • · Paʻa i nā wafers me ke kakaka a hiki i 500 μm
  • · ʻIli hoʻomaʻemaʻe ponoʻī (pale nā ​​​​pores i ke pani ʻana)
  • · Hoʻopau ke kākoʻo like i ke kaumaha kūloko

 

Choʻohana pono ʻana:

Nā ʻano poepoe a huinahā paha, ke anawaena 100–450 mm. Loaʻa ke apo sila lihi no ka kaohi ʻana i ka mīkini hoʻomaʻemaʻe ʻāpana.

 

E noi i kahi hāpana no ka nui o kāu wafer kikoʻī.


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