ʻO ka hopena keramika i uhi ʻia me ka Teflon - ʻIli ʻAʻole e Piʻi no ka lawelawe ʻana i ka wafer koʻikoʻi
Hoʻohui ka mea hoʻokō hopena keramika i uhi ʻia me ka Teflon (PTFE) a St.Cera i kahi substrate alumina ikaika kiʻekiʻe me kahi uhi PTFE like, haʻahaʻa-friction (mānoanoa 15-30 μm). Hāʻawi ka uhi i kahi coefficient haʻahaʻa loa o ka friction (≤0.1), ke kūpaʻa kemika maikaʻi loa, a me nā waiwai ʻaʻole e pipili, e pale ana i ka hoʻopili ʻana o ka wafer a hoʻopau i ka haumia o ka ʻaoʻao hope. Hāʻawi ka substrate keramika ma lalo (99.8% Al₂O₃) i ka ikaika flexural kiʻekiʻe (361-1000 MPa), ke kūpaʻa ʻaʻahu, a me ke kūpaʻa wela a hiki i 260°C (palena uhi). He kūpono kēia mea hoʻokō hopena no ka lawelawe ʻana i nā wafers palupalu, lahilahi, a pipili paha (e laʻa, ma hope o ka uhi photoresist a i ʻole nā kaʻina hana kemika).
Nā kikoʻī (ma muli o ka 99.8% Al₂O₃ substrate me ka uhi PTFE):
| Waiwai | Waiwai |
| Mea Substrate | 99.8% Alumina (ʻAiwi ʻelepani) |
| Mea Uhi | PTFE (Teflon) |
| Mānoanoa o ka uhi ʻana | 15–30 μm |
| Ka helu o ka friction (uhi ʻia) | ≤0.1 |
| Ka Ikaika Flexural Substrate (Al₂O₃) | 361 MPa |
| Paʻakikī o ka Substrate (Al₂O₃) | 16 GPa |
| Ka nui o ka substrate | 3.93 g/cm³ |
| Ka Mahana Hana Loa (palena uhi) | 260°C |
| ʻO ka ʻilikai (ma mua o ka uhi ʻana) | Ra ≤0.4 μm |
| Ikaika Dielectric (substrate) | 15×10⁶ V/m |
Nānā: Hoʻopau ka uhi PTFE i ka mahana kiʻekiʻe loa i 260°C; no nā noi mahana kiʻekiʻe, e noʻonoʻo i ka keramika i uhi ʻole ʻia a i ʻole nā uhi ʻē aʻe.
Nā noi:
- · Ka lawelawe ʻana i nā wafers ma hope o ka uhi ʻana o ka photoresist (nā ʻili pipili)
- · Ka hoʻoili ʻana o nā wafers lahilahi a palupalu paha (e pale aku i ka pipili ʻana)
- · Nā mea hana nānā Semiconductor a me ka metrology
- · ʻO ka automation lumi maʻemaʻe kahi e pono ai e hoʻemi ʻia ka haumia o nā ʻāpana
Kaʻina Hana Hana:
ʻO ka substrate seramika i sintered a wili pololei ʻia → ʻili roughening (plasma etch a i ʻole grit blast) → PTFE spray coating → hoʻōla wela ma 380°C → nānā hope loa. Nānā ʻia kēlā me kēia hopena hopena no ka mānoanoa o ka uhi (eddy current), adhesion (hoʻāʻo ʻoki ʻoki ASTM D3359), a me ke coefficient o ka friction.
Mana Hoʻomalu Kūlana:
Nānā maka 100% no nā lua a i ʻole nā pehu; kūlike ka mānoanoa o ka uhi ʻana i loko o ±5 μm; ʻaʻohe delamination ma hope o ka hoʻāʻo kūlou 90° ma ka coupon hōʻike. Nānā ana i ka hoʻomanawanui OEM (lōʻihi ±0.05 mm, pālahalaha ≤0.1 mm).
Nā Pōmaikaʻi ma mua o nā Uhi ʻole a i ʻole nā Uhi ʻē aʻe:
- · ʻO ka ʻili ʻaʻole e pipili e pale i ka hoʻopili ʻana o ka wafer a me ka haki ʻana
- · ʻO ke koina haʻahaʻa loa o ka friction ma waena o nā uhi keramika
- · Ke kūpaʻa kemika maikaʻi loa (nā waikawa, nā kumu, nā mea hoʻoheheʻe)
- · Hoʻemi i ka hana ʻana o nā ʻāpana ma ka pale ʻana i ka hoʻoili ʻana o nā mea
Nā Palena (nā ʻōlelo e pili ana i ka ʻokoʻa waiwai):
ʻAʻole i loaʻa ka uhi PTFE mai nā papa waiwai mea i hāʻawi ʻia (Al₂O₃, ZrO₂, Si₃N₄, BeO). Hoʻopili pono nā waiwai substrate i ka pepa ʻikepili i hāʻawi ʻia (99.8% Al₂O₃). Hoʻokumu ʻia nā waiwai uhi ma nā kikoʻī PTFE maʻamau o ka ʻoihana, ʻoiai ʻaʻohe ʻikepili uhi i hāʻawi ʻia. No nā noi ma mua o 260°C, ua ʻōlelo ʻia kahi mea hoʻokō hopena keramika i uhi ʻole ʻia.*
Hoʻopilikino ʻana:
Loaʻa i nā lōʻihi 150–1500 mm, nā ʻano piko (paʻa lihi, Bernoulli, pālahalaha), nā ʻano flange kau ʻana e like me ke kaha kiʻi OEM. ʻO ka uhi hapa (nā wahi pili wale nō) a i ʻole ka uhi piha e koho ana.
E noi i kahi hāpana no ka hoʻāʻo ʻana i ka pipili a me ka friction.









