ʻO ke apo hoʻoikaika kino o ke keʻena Alumina maʻemaʻe kiʻekiʻe no nā ʻōnaehana Plasma Etch & CVD

ʻO ke apo hoʻoikaika lumi o St.Cera kahi ʻāpana hana koʻikoʻi i hoʻohana ʻia i nā lako etch plasma, CVD, a me PVD semiconductor. Hana ʻia mai ka 99.8% alumina maʻemaʻe kiʻekiʻe (Al₂O₃), hoʻopuni ke apo i ka lihi wafer e hoʻopaʻa i ka plasma a hoʻonui i ka hoʻolaha ʻana o ka ion angular, no laila e hoʻomaikaʻi ana i ka like ʻana o ka etch ma ka ʻili wafer. Hāʻawi ka mea i ke kū'ē plasma kūikawā, ka ikaika dielectric kiʻekiʻe (15 × 10⁶ V / m), a me ke kūpaʻa wela a hiki i 1600 ° C, e hōʻoiaʻiʻo ana i ka hilinaʻi lōʻihi i nā wahi plasma fluorine- a i ʻole chlorine. ʻO ka ID/OD honua pololei a me ka palahalaha (≤10 μm) e hiki ai ke hoʻonohonoho pololei i ka lihi wafer, e hōʻemi ana i nā hemahema lihi a me ka hanauna ʻāpana.

Nā kikoʻī(ma muli o 99.8% Al₂O₃):

Nā noi:

• · Nā apo hoʻoikaika kino o ke keʻena etch dielectric (oxide, nitride etch)
• · Nā apo lihi o ke keʻena etch Silicon
• · Nā apo hana keʻena CVD
• · Pale pale a me nā apo paʻa o ke keʻena PVD

Kaʻina Hana Hana:

Hoʻopaʻa ʻia ka pauka alumina kiʻekiʻe-maʻemaʻe i ke ʻano isostatically → mīkini ʻōmaʻomaʻo i ke ʻano kokoke i ka ʻupena → sintered ma 1600°C → wili daimana CNC o ID, OD, a me ka mānoanoa → lapping e hoʻokō i ka palahalaha ≤10 μm → hoʻomaʻemaʻe ultrasonic → nānā ʻana 100% CMM. Hoʻemi ka hoʻopau ʻana o ka ʻili Ra ≤0.4 μm i ka hoʻopili ʻana o nā ʻāpana.

Mana Hoʻomalu Kūlana:

• · Nānā ʻana o 100% dimensional (ID, OD, mānoanoa, parallelism)
• · Hoʻāʻo komo ʻana o ka dye no nā micro-cracks (ʻaʻole ʻae ʻia nā māwae)
• · Nānā maka ma lalo o ka microscope 20× — ʻaʻohe ʻāpana, hakahaka, a i ʻole ke kala ʻana o ke kala
• · Hoʻāʻo ikaika dielectric e like me ASTM D149 (laʻana)

Nā Pōmaikaʻi ma luna o nā Apo Focus Silicon a i ʻole Quartz:

• · 5–10× lōʻihi ke ola ma ka plasma fluorocarbon
• · ʻAʻohe ʻāpana ʻino e hoʻopau ʻia e hoʻohaumia i nā wafers
• · ʻO ka ikaika dielectric kiʻekiʻe e pale aku i ka arcing
• · Mālama i ka palahalaha a me ka pololei o ka dimensional ma luna o nā tausani o nā hola RF

Mea ʻē aʻe — Yttria-Stabilized Zirconia (ZrO₂):

No nā noi e koi ana i ka paʻakikī haki kiʻekiʻe (e laʻa, nā keʻena me ka hoʻokele wela pinepine a i ʻole ka haʻalulu mechanical), loaʻa nā apo focus ZrO₂ (density 6.03 g/cm³, flexural strength 1000 MPa, fracture toughness 5–8 MPa·m¹/²). Eia nō naʻe, hāʻawi ka alumina i ka uku kūpono maikaʻi a ʻo ia ke kūlana ʻoihana no ka hapa nui o nā noi apo focus.

Hoʻopilikino ʻana:

• · Nā ʻaoʻao ʻanuʻu, nā counterbores, a i ʻole nā ​​​​lua kau ʻana no kēlā me kēia kaha kiʻi o ka mea kūʻai aku
• · Uhi ʻana Y₂O₃ no ka hoʻoikaika ʻana i ke kūpaʻa ʻana i ka erosion plasma (mānoanoa 20–100 μm)
• · Ka māka laser o ka helu ʻāpana, ke code lā, a i ʻole nā ​​māka hoʻonohonoho

Hoʻomaopopo:Hoʻopili pono nā ʻikepili āpau i ka papa waiwai Al₂O₃ i hāʻawi ʻia. No nā kikoʻī ZrO₂, e nānā i ka pepa ʻikepili zirconia i hāʻawi ʻia. Pono paha nā hoʻolālā apo focus i ka ʻae palapala hoʻopaʻa inoa - na nā mea kūʻai aku ke kuleana no ka hōʻoia ʻana i nā kuleana waiwai noʻeau.