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ʻO ka mea hoʻopau hopena seramika alumina maʻemaʻe kiʻekiʻe no nā robots lawelawe wafer

ʻO ka mea hoʻopau hopena seramika alumina maʻemaʻe kiʻekiʻe no nā robots lawelawe wafer

Wehewehe Pōkole:

Ua hana pololei ʻia ka hopena hopena alumina ceramic a St.Cera mai ka 99.8% Al₂O₃ kiʻekiʻe-maʻemaʻe me ka hoʻohana ʻana i nā lako wili CNC 5-axis holomua. ʻO kā mākou mau hiki ke hana ʻana e komo pū me nā mīkini wili pololei a me nā kikowaena mīkini CNC, e hiki ai ke hana i nā geometries paʻakikī me ka pololei kiʻekiʻe. Hōʻike ka hopena hopena i kahi ʻano lahilahi (lahilahi e like me 1.5 mm) me kahi lihi alakaʻi tapered no ka hoʻokomo wafer laumania. Hāʻawi ka mea i ka paʻakikī kiʻekiʻe (Young's modulus 380 GPa), ke kūpaʻa ʻana i ka ʻaʻahu maikaʻi loa, a me ke kūpaʻa wela a hiki i 800°C. Hoʻowali pololei ʻia kēlā me kēia ʻāpana e hoʻokō i ka pālahalaha o 0.003mm, parallelism o 0.002mm, a me ka hoʻopau ʻana o ka ʻili o Ra0.1, e hōʻoiaʻiʻo ana i ka pili wafer kūlike a me ka hana ʻole o nā ʻāpana i nā wahi semiconductor FAB. Loaʻa i nā lōʻihi mai 150 mm a 450 mm, me nā geometries tip maʻamau (edge ​​grip, Bernoulli, flat) a me nā flanges kau e kūpono i nā robots OEM. ʻO nā koho hoʻopau ʻili e komo pū me ka uhi lapped, polished, a i ʻole ka uhi dissipative ESD (10⁶–10⁹ Ω/sq).


Nā kikoʻī huahana

Nā Lepili Huahana

Ua hana pololei ʻia ka hopena hopena alumina ceramic a St.Cera mai ka 99.8% Al₂O₃ kiʻekiʻe-maʻemaʻe me ka hoʻohana ʻana i nā lako wili CNC 5-axis holomua. ʻO kā mākou mau hiki ke hana ʻana e komo pū me nā mīkini wili pololei a me nā kikowaena mīkini CNC, e hiki ai ke hana i nā geometries paʻakikī me ka pololei kiʻekiʻe. Hōʻike ka hopena hopena i kahi ʻano lahilahi (lahilahi e like me 1.5 mm) me kahi lihi alakaʻi tapered no ka hoʻokomo wafer laumania. Hāʻawi ka mea i ka paʻakikī kiʻekiʻe (Young's modulus 380 GPa), ke kūpaʻa ʻana i ka ʻaʻahu maikaʻi loa, a me ke kūpaʻa wela a hiki i 800°C. Hoʻowali pololei ʻia kēlā me kēia ʻāpana e hoʻokō i ka pālahalaha o 0.003mm, parallelism o 0.002mm, a me ka hoʻopau ʻana o ka ʻili o Ra0.1, e hōʻoiaʻiʻo ana i ka pili wafer kūlike a me ka hana ʻole o nā ʻāpana i nā wahi semiconductor FAB. Loaʻa i nā lōʻihi mai 150 mm a 450 mm, me nā geometries tip maʻamau (edge ​​grip, Bernoulli, flat) a me nā flanges kau e kūpono i nā robots OEM. ʻO nā koho hoʻopau ʻili e komo pū me ka uhi lapped, polished, a i ʻole ka uhi dissipative ESD (10⁶–10⁹ Ω/sq).

 

Nā kikoʻī (ma muli o 99.8% AlO& nā hiki ke hana ʻo St.Cera):

Waiwai Waiwai
Mea Hana 99.8% Alumina (ʻAiwi ʻelepani)
Ka nui o ka paʻa 3.93 g/cm³
Ikaika Flexural 361 MPa
Paʻakikī Vickers 16 GPa
Modulus o Young 380 GPa
Palahalaha 0.003mm
Parallelism 0.002mm
Hoʻopau ʻili Ra0.1 (pāʻani ʻia/pololei ʻia)
Mahana Hana Loa 800°C
Ka laulā lōʻihi 150–450 mm

 

Nā noi:

  • · Hoʻoili Wafer i loko o nā robots vacuum a me ka lewa
  • · Nā mea hoʻopau hopena automation FAB no nā wafers 200mm/300mm
  • · Ka lawelawe ʻana i ka wafer lahilahi (me ke koho ESD)

 

Nā Mana Hana:
ʻO kā mākou mau mīkini wili pololei a me nā kikowaena mīkini CNC e hiki ai ke hana i nā ʻāpana seramika paʻakikī me:

  • · Ka lōʻihi o ka mīkini hana kiʻekiʻe loa: 1500mm
  • · Ke anawaena waho kiʻekiʻe loa: 600mm
  • · Ke anawaena o loko haʻahaʻa loa: 0.2mm
  • · Mānoanoa loa: 100mm

 

Mana Hoʻomalu Kūlana:
Pololei 0.005mm, perpendicularity 0.005mm, poepoe 0.002mm, parallelism 0.002mm, concentricity 0.01mm i hōʻoia ʻia e CMM. Hoʻomaʻemaʻe ʻia kēlā me kēia ʻāpana me ka ultrasonically a ua hoʻopili ʻia me ka lumi maʻemaʻe Class 100.


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