ʻO ka Porous SiC Vacuum Chuck i kākoʻo ʻia e ka Metal no ka lawelawe ʻana i ka wafer Warped & Thin

Hoʻohui ka mīkini hoʻomaʻemaʻe keramika metala a St.Cera i kahi papa keramika porous silicon carbide (SiC) me kahi kumu metala i hana ʻia me ka mīkini kikoʻī (alumini a kila kila ʻole paha). Hāʻawi ka mea porous SiC (uliuli-ʻeleʻele, porosity 35-40%, nui o ka pore 20-30 μm, permeability 60 ml/cm²·min) i ka hoʻolaha like ʻana o ka vacuum ma ka ʻili wafer holoʻokoʻa, e hoʻopau ana i ka māka lihi a hiki ke kākoʻo ʻole i ka hoʻopili ʻana no nā wafers lahilahi (≤100 μm) a i ʻole nā ​​​​wafers warped. Hāʻawi ka papa SiC i ka hoʻonui wela haʻahaʻa (3.5 × 10⁻⁶/℃), kūpaʻa wela a hiki i 1000°C, a me ka ikaika flexural kūpono (32-35 MPa). Hoʻohui ke kumu metala i ka paʻakikī o ke kūkulu ʻana, ka maʻalahi o ke kau ʻana ma o nā lua wili, a me ka pale ʻana i ka haki brittle. He kūpono kēia chuck no ka wili ʻana i ka ʻaoʻao hope, dicing, a me ka hana wafer wela kiʻekiʻe kahi e koʻikoʻi ai ka vacuum like a me ka hoʻohālikelike wela.

Nā kikoʻī (ma muli o ka ʻikepili SiC porous i hāʻawi ʻia):

Nānā: ʻOi aku ka haʻahaʻa o ka ikaika flexural ma mua o ka SiC dense ma muli o ka porosity. ʻAʻole nā ​​​​​​waiwai kumu metala mai nā papa keramika.

Nā noi:

• · Ke wili ʻana i nā wafers lahilahi ma ka ʻaoʻao hope (≤100 μm)
• · Ke kau ʻana o ka wafer warped no ka dicing
• · Ke kuʻi ʻana i ka wafer wela kiʻekiʻe (a hiki i 1000°C)
• · Hoʻopaʻa ʻūlū no nā substrates porous a palupalu paha

Hana ʻana:

Papa SiC porous (i hana ʻia me nā mea hana pore, sintered) → i hoʻopaʻa ʻia i ka pālahalaha ≤10 μm → kumu metala i hana ʻia me nā puka vacuum a me nā hiʻohiʻona kau ʻana → epoxy bonding a i ʻole mechanical clamping → hoʻāʻo helium leak.

Mana Hoʻomalu Kūlana:

• · Ua hōʻoia ʻia ka porosity a me ka nui o ka pore e SEM
• · Hoʻāʻo permeability (kahe ʻana o ka ea)
• · I ana ʻia ka pālahalaha me ka laser interferometer
• · Ka helu o ka hoʻokahe ʻana o ka helium <1×10⁻⁹ Pa·m³/s

Nā Pōmaikaʻi ma luna o nā Grooved a i ʻole Dense Ceramic Chucks:

• · ʻAʻohe māka wafer - vacuum like me ka ʻole o nā lua ʻokoʻa
• · Nā pores hoʻomaʻemaʻe ponoʻī - hoʻemi ʻia ke pani ʻana
• · Hoʻohana i nā wafers i wili ʻia (a hiki i ka 500 μm bow)
• · Pale ke kumu metala i ka haki palupalu a hoʻomaʻalahi i ka hoʻohui ʻana

Nā Palena:

• · Ka ikaika flexural haʻahaʻa (32–35 MPa) - pale i ka hoʻouka ʻana o ka hopena
• · Ua kaupalena ʻia ka mahana hana i 1000°C (porous SiC), akā ua kaupalena ʻia ka pilina epoxy kumu metala i ≤200°C ke ʻole e hoʻopaʻa ʻia me ka mīkini
• · ʻAʻole no ka vacuum kiʻekiʻe-kaomi (ua kaupalena ka ʻōnaehana porous i ka ʻokoʻa vacuum max)

Hoʻopilikino ʻana:

• · Kumu hao: alumini (māmā), kila kila (kūpaʻa i ka palaho), Invar (hoʻonui haʻahaʻa)
• · Hoʻopaʻa: epoxy (≤200°C) a i ʻole ka mīkini paʻa (a hiki i ka 500°C)
• · Apo sila lihi no ka mana hoʻokahe ʻāpana

E ʻoluʻolu e hoʻomaopopo: ʻOi aku ka haʻahaʻa o ka ikaika flexural i hāʻawi ʻia (32–35 MPa) ma mua o nā keramika paʻa ma muli o ka porosity. E lawelawe me ke akahele e pale aku i ka haki ʻana o ka lihi.