Papa Hoʻolaha Kinoea Alumina no ke poʻo ʻauʻau CVD/PVD
Ua hana ʻia ka papa hoʻolaha kinoea (poʻo ʻauʻau) a St.Cera me ka mīkini kikoʻī mai ka seramika alumina 99.8% kiʻekiʻe. Loaʻa iā ia kahi pūʻulu o nā lua liʻiliʻi (diameters 0.3–1.5 mm) e hōʻoiaʻiʻo ana i ke kahe like ʻana o ke kinoea ma ka ʻili wafer i ka wā o nā kaʻina hana CVD, PVD, a i ʻole ALD. ʻO ka ikaika dielectric kiʻekiʻe o ka papa (>15 × 10⁶ V / m) a me ke kū'ē ʻana o ka plasma e pono ai no ka waiho ʻana o ka semiconductor thin-film.
Nā kikoʻī:
| Waiwai | Waiwai |
| Mea Hana | 99.8% Al₂O₃ a i ʻole SiC |
| Anawaena | 100 – 1500mm (poepoe) a i ʻole ʻehā huinahā |
| Mānoanoa | 5 – 20 mm |
| Anawaena o ka lua | 0.3 – 1.5 mm |
| ʻAno puka | Maʻamau (huinakolu, huinahā, radial) |
| Palahalaha | ≤10 μm ma luna o ka ʻāpana piha |
| ʻO ka ʻōʻili | Ra ≤0.6 μm (ʻaoʻao kinoea) |
| Laki o ka ʻĀpana Hāmama | 5–15% |
Nā noi:
Nā papa ʻauʻau PECVD
Nā mea hoʻokomo kinoea ALD
Nā papa hoʻolaha kinoea o ke keʻena etch
Nā ʻāpana reactor MOCVD
Hana ʻana:
ʻO ka substrate alumina i hoʻopaʻa ʻia i ka pālahalaha → ʻeli CNC me nā mea hana i uhi ʻia i ka daimana (ʻae ʻia ke kūlana lua ± 0.02 mm) → deburring → hoʻomaʻemaʻe ultrasonic → ʻōpala Class 100.
Mana Hoʻomalu Kūlana:
Ua nānā ʻia kēlā me kēia pā no ka nui o ka lua (ʻōnaehana ʻike), ka pālahalaha (interferometer laser), a me ke ʻano like o ke kahe ʻana o ke kinoea (palapala kaomi). ʻAʻohe micro-māwae ma lalo o ka microscope 20x.
Nā Pōmaikaʻi ma luna o nā Papa Metala:
ʻAʻohe haumia metala i nā ʻili lahilahi
Ka hanauna ʻāpana haʻahaʻa (ʻaʻohe ʻōpala pala)
Kū i nā plasma hoʻomaʻemaʻe ikaika (CF₄, NF₃)
Nā Hiʻohiʻona Maʻamau:
Nā kahawai kinoea ma hope, nā lua i hoʻomoe ʻia, nā sila lihi, a me nā ʻano mea like ʻole (SiC no ka conductivity wela kiʻekiʻe, ka uhi ʻana o Y₂O₃ no ke kūpaʻa plasma).
Hāʻawi mākou i ka hōʻoia CAD a me ka hoʻohālike kahe ma mua o ka hana ʻana.
